How US AI Chip Export Controls Work (as of October 2026)
US export rules sort AI chips by two numbers, total processing performance and performance density, and then by where the chip is going and who ultimately owns the buyer. Here is how the pieces fit, from the October 2023 rule to the UAE's move into Country Group A:5 in July 2026, and why November 10, 2026 is the next date to watch.
Checked against the Federal Register through 91 FR 43034
- Federal Register rule
- BIS announcement (not a Federal Register rule)
- Affiliates rule stayed, Nov 10, 2025 to Nov 9, 2026
- Open marker: scheduled, absent an extension
As of Federal Register texts and BIS statements; dates are publication dates
| Published | Rule | Citation | What changed | Status |
|---|---|---|---|---|
| Oct 25, 2023 | Advanced computing rule1Effective Nov 17, 2023 | 88 FR 73458 · FR Doc 2023-23055 | Rewrote ECCN 3A090 around total processing performance and performance density; license requirement to Country Groups D:1, D:4 and D:5, except destinations also in A:5 or A:6 | In forceAs amended; its TPP definition is cited by the 2026 rules |
| Dec 5, 2024 | HBM and foreign direct product rule2Effective Dec 2, 2024 | 89 FR 96790 · FR Doc 2024-28270 | Added high-bandwidth memory as ECCN 3A090.c, License Exception HBM, and two new foreign direct product rules for chipmaking equipment | In forceNo later Federal Register change found |
| Jan 15, 2025 | Framework for AI Diffusion3Compliance date May 15, 2025 | 90 FR 4544 · FR Doc 2025-00636 | Worldwide license requirement for 3A090.a and 4A090.a; new License Exceptions AIA, ACM and LPP; country compute allocations; ECCN 4E091 for model weights | Not enforcedNo rescission rule in the Federal Register |
| May 13, 2025 | BIS rescission announcement4Press release, not a rule | bis.gov press release | Announced the diffusion rule's rescission and told enforcement officials not to enforce it; said a formal rescission and a replacement rule would follow | BIS statement |
| Sep 30, 2025 | Affiliates rule5Effective Sep 29, 2025 | 90 FR 47201 · FR Doc 2025-19001 | Any entity at least 50% owned by one or more Entity List parties became subject to Entity List restrictions; same for military end users and certain sanctioned parties | StayedUntil Nov 9, 2026 |
| Nov 12, 2025 | One-year suspension6Effective Nov 10, 2025 | 90 FR 50857 · FR Doc 2025-19846 | Stayed the affiliates rule until Nov 9, 2026; its provisions are written back into the EAR effective Nov 10, 2026, absent a future extension | In forceNo extension published as of Oct 13, 2026 |
| Jan 15, 2026 | License review policy revision7Effective Jan 15, 2026 | 91 FR 1684 · FR Doc 2026-00789 | Case-by-case review, instead of presumption of denial, for exports to China and Macau of chips below TPP 21,000 and 6,500 GB/s total DRAM bandwidth, if nine certifications are met | In force |
| May 31, 2026 | BIS enforcement guidance8Guidance, not a rule | bis.gov guidance PDF | Confirmed the license requirement for advanced computing items to entities headquartered in D:5 or Macau, wherever they are located, is still enforced | BIS statement |
| Jul 14, 2026 | UAE favorable treatment rule9Effective Jul 10, 2026 | 91 FR 43034 · FR Doc 2026-14132 | Moved the UAE out of Country Groups D:3 and D:4 and into A:5; license-free advanced computing items for UAE government agencies and entities listed in supplement no. 8 to part 740 | In force |
The rules and BIS statements that set today's controls on AI chips, in publication order. "Status" is what the Federal Register and BIS texts show as of Oct 13, 2026: "In force" means no later Federal Register document removing it was found in a search of BIS rules published since May 1, 2025.11 Left out: Entity List additions, chipmaking-equipment details, the January 2025 foundry due diligence rule and the 2022 rule that the 2023 rule replaced. These are legal texts, not measurements, so no figure labels apply (how labels work).
As of Thresholds as written in the Federal Register
| Provision | What it covers | Threshold | Status |
|---|---|---|---|
| 3A090.a.1 | Chips by TPP alone1 | TPP ≥ 4,800 | In force |
| 3A090.a.2 | Chips by TPP and density1 | TPP ≥ 1,600 and density ≥ 5.92 | In force |
| 3A090.b.1 | Mid-tier chips1 | 2,400 ≤ TPP < 4,800 and 1.6 ≤ density < 5.92 | In force |
| 3A090.b.2 | Mid-tier chips1 | TPP ≥ 1,600 and 3.2 ≤ density < 5.92 | In force |
| 4A090.a | Computers, assemblies and components1 | Contain an IC meeting 3A090.a | In force |
| 3A090.c | High-bandwidth memory2 | Memory bandwidth density > 2 GB/s per mm² | In force |
| § 740.25 (HBM) | License exception for HBM2 | Memory bandwidth density < 3.3 GB/s per mm² | In force |
| § 742.6(b)(10)(iii)(A)(1) | Case-by-case review, China and Macau7 | TPP < 21,000 and total DRAM bandwidth < 6,500 GB/s | In force |
| Supp. 2 to part 748, (dd)(1)(iii) | China and Macau volume condition7 | Aggregate TPP ≤ 50% of aggregate TPP shipped to US customers | In force |
| 4E091 | Closed model weights (diffusion rule)3 | Trained with ≥ 1026 operations | Not enforced |
| § 740.29 (LPP) | Low-volume exception (diffusion rule)3 | Up to 26,900,000 TPP per consignee per year | Not enforced |
| § 742.6(b)(10) | Country allocation, 2025–2027 (diffusion rule)3 | 790,000,000 TPP cumulative | Not enforced |
TPP is total processing performance; "density" is performance density, TPP divided by applicable die area in mm². The diffusion-rule rows were never enforced after BIS's May 13, 2025 announcement.4 A product's own TPP is the exporter's classification against the definitions; this table lists only the legal thresholds.
How it works
1. What's controlled: ECCN 3A090, 4A090 and two numbers
US export controls on AI chips sit in the Export Administration Regulations (EAR), run by the Commerce Department's Bureau of Industry and Security (BIS). Each controlled item has an Export Control Classification Number (ECCN). AI accelerators fall under ECCN 3A090, which names GPUs, TPUs, neural processors and ASICs among the integrated circuits it covers, and the servers and boards built around them fall under 4A090.1
The October 2023 rule replaced the original 2022 parameters with two numbers.1 Total processing performance (TPP) is 2 × MacTOPS × the bit length of the operation, summed over all processing units on the chip, at the highest rate the manufacturer claims. The rule's own example: 300 teraFLOPS at 16 bits reaches TPP 4,800, as do 600 tera integer operations at 8 bits. A chip that supports both sparse and dense matrices is rated on its dense figure. Performance density is TPP divided by the "applicable die area" in mm², counting logic dies made on non-planar (FinFET-class) transistor processes.1
A chip with TPP of 4,800 or more, or TPP of 1,600 or more with density of 5.92 or more, is 3A090.a; a tier below that is 3A090.b (the table above gives the bands). Chips that aren't designed or marketed for data centers and stay below TPP 4,800 fall outside 3A090.1
2. Who needs a license: country groups and headquarters
Whether a license is needed depends on the destination's Country Group in supplement no. 1 to part 740. The 2023 rule requires a license for 3A090 and 4A090 items going to Country Groups D:1, D:4 and D:5, which BIS describes as countries of national security concern, missile technology concern and US arms embargoes respectively, unless the destination is also in Country Group A:5 or A:6.1
The license review policy then sets the odds. Applications for Macau and D:5 destinations are reviewed under a presumption of denial, as are those for any entity headquartered in, or whose ultimate parent is headquartered in, Macau or a D:5 country, wherever the entity sits. Other destinations get a presumption of approval.1 BIS's May 31, 2026 guidance confirmed that this headquarters test, first introduced on November 17, 2023, is still enforced.8 The 2023 rule also created License Exception Notified Advanced Computing (NAC) for 3A090.b chips and for non-data-center 3A090.a chips; shipments under it to Macau or D:5 require advance notice to BIS.1
3. HBM and the foreign direct product rules (December 2024)
The December 2024 rule added high-bandwidth memory (HBM) as ECCN 3A090.c: memory with a "memory bandwidth density" above 2 GB per second per mm², measured as the package's bandwidth divided by its area. BIS said every HBM stack then in production exceeded that threshold, and that it used density rather than raw bandwidth so the control would still apply to a larger number of smaller stacks.2 Chips that co-package HBM with logic whose main job is processing aren't 3A090.c, though they may fall under 3A090.a or .b depending on their TPP and density.2
HBM needs a license to Macau and D:5 destinations. A new License Exception HBM covers memory below 3.3 GB/s per mm² moving between packaging sites owned by US or allied-headquartered companies that track every unit.2 The same rule added two foreign direct product (FDP) rules, which make certain foreign-made chipmaking equipment subject to the EAR when it is bound for advanced fabs in D:5 or Macau, or for Entity List parties marked with Footnote 5, and is the product of US technology or software or contains a component that is. Foreign-made 3A090.c memory also became subject to the EAR where it meets the scope of the existing advanced computing FDP rule.2
4. The AI diffusion rule, and what "rescinded" means here
The Framework for Artificial Intelligence Diffusion, published January 15, 2025, would have made 3A090.a and 4A090.a licensable worldwide. It added License Exception AIA for 18 listed destinations plus the United States, a low-volume exception (LPP) of up to 26,900,000 TPP per consignee per year, a cumulative country allocation of 790,000,000 TPP for 2025 through 2027, and ECCN 4E091 for the weights of closed models trained with 1026 or more operations. Compliance was due May 15, 2025.3
On May 13, 2025, BIS announced the rule's rescission, said its under secretary had instructed enforcement officials not to enforce it, and said BIS "plans to publish a regulation formalizing the rescission and will issue a replacement rule in the future." The same release announced guidance on the risks of using specific Huawei Ascend chips.4 As of October 13, 2026, no rescission rule appears in the Federal Register.11 The July 2026 UAE rule describes the result: the worldwide license requirement still sits in § 742.6(a)(6)(iii)(A), but BIS enforces it only for D:1, D:4 and D:5 destinations (except those also in A:5 or A:6) and for entities headquartered in D:5 or Macau.9
5. The affiliates ("50%") rule and its one-year stay
Until September 2025, Entity List restrictions applied only to the entities named on the list. The affiliates rule, effective September 29, 2025, extended them to any entity at least 50% owned, directly or indirectly, individually or in the aggregate, by one or more listed entities, and did the same for listed military end users and certain sanctioned parties. BIS said the 50% standard follows long-standing Treasury Department practice.5 It applies to every item subject to the EAR, not only AI chips.
On November 12, 2025, BIS stayed it. The stay took effect November 10, 2025 and runs to November 9, 2026, "absent a future extension"; the same rule writes the affiliates provisions back into the EAR effective November 10, 2026.6 No extension had been published in the Federal Register as of October 13, 2026.11
6. H200-class chips to China: case-by-case review (January 2026)
The January 15, 2026 rule changed the review policy, not the license requirement. Exports from the United States to end users in China or Macau of chips with TPP below 21,000 and "total DRAM bandwidth" below 6,500 GB/s, which the rule says covers the Nvidia H200 and the AMD MI325X, move from a presumption of denial to case-by-case review, provided the applicant certifies nine conditions.7
Among them: enough US supply that no US order is delayed, and no diversion of foundry capacity from US customers; aggregate TPP exported to China and Macau of no more than 50% of the aggregate TPP of the same product shipped to US customers for US end use; know-your-customer and physical security measures; a list of remote cloud users in eight named destinations, China and Macau among them; and a review of every shipment, before export, by a US-headquartered third-party testing lab with no stake in the deal, testing in the United States (a representative sample of each batch is allowed). Reexports, and exports to entities headquartered in D:5 or Macau but located elsewhere, stay under a presumption of denial.7
Neither this rule nor Proclamation 11002 of January 14, 2026, which set a 25% tariff on imports of certain advanced computing chips not used for the US technology buildout, describes a revenue-sharing arrangement on exports to China, so this explainer doesn't cover one.710
7. The UAE moves to Country Group A:5 (July 2026)
The rule effective July 10, 2026 removed the United Arab Emirates from Country Groups D:3 and D:4 and added it to A:5, which opens License Exception Strategic Trade Authorization (STA) to the UAE government and approved entities. Licenses are still required for 3A090 and 4A090 items going to the UAE, except where the ultimate consignee and all end users are UAE government agencies or entities listed in a new supplement no. 8 to part 740.9
That supplement lists G42 (with G42 Cloud Technology) and Core42, whose approval expires April 6, 2027 absent further notice, and eight US-headquartered companies and their subsidiaries: Amazon, Apple, Google, Meta, Microsoft, OpenAI Group PBC, Oracle and X.AI. BIS also said it intends to review favorably license applications involving MGX for chips and servers exported to the UAE.9
8. What to watch next
On the current texts, the next scheduled change is November 10, 2026, when the affiliates rule's provisions return unless BIS publishes an extension first.6 The replacement for the diffusion rule that BIS announced in May 2025 had not appeared in the Federal Register as of October 13, 2026.411 This explainer describes the rules as published; it isn't legal advice, and classification or licensing questions go to BIS through the procedures in part 748 of the EAR.8
Sources
- Bureau of Industry and Security, "Implementation of Additional Export Controls: Certain Advanced Computing Items; Supercomputer and Semiconductor End Use; Updates and Corrections," interim final rule, 88 FR 73458, FR Doc. 2023-23055, Oct 25, 2023, govinfo PDF, retrieved 2026-10-13.
- Bureau of Industry and Security, "Foreign-Produced Direct Product Rule Additions, and Refinements to Controls for Advanced Computing and Semiconductor Manufacturing Items," interim final rule, 89 FR 96790, FR Doc. 2024-28270, Dec 5, 2024, govinfo PDF, retrieved 2026-10-13.
- Bureau of Industry and Security, "Framework for Artificial Intelligence Diffusion," interim final rule, 90 FR 4544, FR Doc. 2025-00636, Jan 15, 2025, govinfo PDF, retrieved 2026-10-13.
- Bureau of Industry and Security, "Department of Commerce Announces Rescission of Biden-Era Artificial Intelligence Diffusion Rule, Strengthens Chip-Related Export Controls", press release, May 13, 2025, retrieved 2026-10-13.
- Bureau of Industry and Security, "Expansion of End-User Controls To Cover Affiliates of Certain Listed Entities," interim final rule, 90 FR 47201, FR Doc. 2025-19001, Sep 30, 2025, govinfo PDF, retrieved 2026-10-13.
- Bureau of Industry and Security, "One Year Suspension of Expansion of End-User Controls for Affiliates of Certain Listed Entities," final rule; stay, 90 FR 50857, FR Doc. 2025-19846, Nov 12, 2025, govinfo PDF, retrieved 2026-10-13.
- Bureau of Industry and Security, "Revision to License Review Policy for Advanced Computing Commodities," final rule, 91 FR 1684, FR Doc. 2026-00789, Jan 15, 2026, govinfo PDF, retrieved 2026-10-13.
- Bureau of Industry and Security, "Guidance Regarding Enforcement of License Requirements for Advanced Computing Items for Entities Headquartered in Country Group D:5 and Macau", May 31, 2026, retrieved 2026-10-13.
- Bureau of Industry and Security, "Enhanced Favorable Treatment for the United Arab Emirates Under the Export Administration Regulations," final rule, 91 FR 43034, FR Doc. 2026-14132, Jul 14, 2026, govinfo PDF, retrieved 2026-10-13.
- The President, "Adjusting Imports of Semiconductors, Semiconductor Manufacturing Equipment, and Their Derivative Products Into the United States," Proclamation 11002 of Jan 14, 2026, 91 FR 2443, FR Doc. 2026-01052, Jan 20, 2026, govinfo PDF, retrieved 2026-10-13.
- Federal Register, document search of Bureau of Industry and Security publications, Nov 1, 2025 onward and rules, May 1 to Oct 31, 2025, retrieved 2026-10-13.