AI Accelerators With the Most HBM per Chip (October 2026)
Thirteen shipping or generally available data-center accelerators ranked by the HBM their makers state per chip. Nvidia’s Rubin and AMD’s MI350X and MI355X share #1 at 288 GB; AMD’s MI455X, at 432 GB, is in production but not yet confirmed as shipping.
HBM per chip, top 9 GB
Rubin288
MI350X288
MI355X288
Blackwell Ultra (GB300)279
B300 (HGX)270
MI325X256
Maia 200216
TPU7x Ironwood192
MI300X192
Vendor-stated figures, as of Oct 13, 2026. Bars are relative to the largest (288 GB).
Chart: on-package HBM per chip for the nine shipping accelerators with the most, from three tied at 288 GB down to Google’s TPU7x and AMD’s MI300X at 192 GB.
As of All figures vendor-statedTies share a rank, listed by bandwidth
AI Accelerators With the Most HBM per Chip (October 2026), vendor-stated HBM per chip in GB, as of 2026-10-13
Ranked by on-package high-bandwidth memory (HBM) capacity per accelerator chip, in GB, exactly as each maker states it; all figures are vendor-stated and none are independently measured. Bandwidth is the maker’s peak memory bandwidth per chip and is not the ranked metric; it only orders tied rows (ties then alphabetical). Included: data-center accelerators that are shipping or generally available, each with a maker or filing source for that status in the Availability column. Where NVIDIA states different per-GPU memory for the same GPU in different systems, each system gets a row (Blackwell Ultra: 279 GB in GB300 NVL72, 270 GB in HGX B300; Blackwell: 186 GB in GB200 NVL72, 180 GB in HGX B200). Rubin bandwidth follows NVIDIA’s HGX page (22 TB/s per GPU in HGX Rubin NVL8)1; NVIDIA’s Vera Rubin NVL72 page lists 19.2 TB/s per GPU in that rack2, which would not change the order. Google’s TPU7x page says “192 GB” in its text but heads its table column in GiB (192 GiB is about 206 GB)16; on that reading Ironwood would rank #8 alone and the MI300X #9. “Current product” means AMD lists the part among its Instinct data center GPU products in its 2025 annual report; “Shipping”, “Cloud GA” and “Deployed in Azure” quote the maker’s own status. Makers write HBM3E and HBM3e interchangeably; the table uses HBM3E. Left out: announced parts that aren’t shipping yet (below), Huawei’s Ascend 910C (no Huawei page we opened states its memory). Cross-checked against Epoch AI’s ML hardware dataset (CC BY 4.0)26, whose capacities match every part it lists except the GB300 GPU (287.5 GB there). Figure labels: how they work.
The top 10
#1
Rubin GPU (NVIDIA)
288 GB HBM4
NVIDIA’s Rubin GPU is the only shipping part in the table with HBM4 memory. NVIDIA’s HGX page lists 288 GB of HBM4 at 22 TB/s per GPU for HGX Rubin NVL81, while its Vera Rubin NVL72 page lists the same 288 GB at 19.2 TB/s per GPU, and 20.7 TB of HBM4 across the 72-GPU rack2. NVIDIA says Vera Rubin is ramping into full production, with server makers shipping Vera Rubin-based systems2. CoreWeave received its first Vera Rubin NVL72 production racks in September 2026, according to NVIDIA3.
Video: NVIDIA's official video on the Rubin platform's bring-up (NVIDIA channel). Vendor video.#1
Instinct MI350X (AMD)
288 GB HBM3E
AMD’s MI350X carries 288 GB of HBM3E at 8 TB/s peak bandwidth, the same memory as the MI355X, on AMD’s CDNA 4 architecture11. AMD lists its launch date as June 12, 2025 and its typical board power as 1,000 W11. In its 2025 annual report, AMD says large hyperscale customers, OEMs and ODMs deployed its Instinct MI350 Series GPUs during the year12. It ties with Rubin and the MI355X on capacity and sits after Rubin only because its bandwidth is lower.
Video: AMD's official introduction to the Instinct MI350 Series, which includes the MI350X and MI355X (AMD channel). Vendor video.#1
Instinct MI355X (AMD)
288 GB HBM3E
The MI355X is the higher-power sibling of the MI350X: AMD lists the same 288 GB of HBM3E and 8 TB/s, a 256 MB last-level cache and a typical board power of 1,400 W, built on TSMC 3nm and 6nm processes10. It launched on the same date, June 12, 202510. AMD’s 2025 annual report says it launched the MI350 Series in June and that cloud providers including Meta and Oracle have since expanded availability of MI350-based infrastructure12.
#4
Blackwell Ultra GPU in GB300 NVL72 (NVIDIA)
279 GB HBM3E
NVIDIA’s Blackwell Ultra datasheet gives each GPU in the GB300 NVL72 rack 279 GB of HBM3E at 8 TB/s, and describes 279 GB of HBM3E per Blackwell Ultra chip with up to 37 TB of fast memory per rack4. The GB300 NVL72 page lists the rack as “Available Now”, with 20 TB of GPU memory across 72 Blackwell Ultra GPUs5. Epoch AI’s hardware dataset records this GPU at 287.5 GB26; the table uses NVIDIA’s own datasheet figure.
#5
Blackwell Ultra GPU in HGX B300 (NVIDIA)
270 GB HBM3E
In the eight-GPU HGX B300 server, NVIDIA’s datasheet lists each Blackwell Ultra GPU at 270 GB of HBM3E and 7.7 TB/s, lower than the same GPU in the GB300 NVL72 rack4. NVIDIA’s HGX page gives the baseboard 2.1 TB of total memory and states that HGX B300 and HGX B200 are shipping now1. Because NVIDIA states different per-GPU memory for the two systems, each gets its own row.
#6
Instinct MI325X (AMD)
256 GB HBM3E
AMD’s MI325X, launched October 10, 2024, has 256 GB of HBM3E on an 8,192-bit memory interface at a 6 GHz memory clock, for 6 TB/s of peak bandwidth13. It keeps the MI300X’s CDNA 3 architecture and 19,456 stream processors but moves from HBM3 to HBM3E1314. AMD’s 2025 annual report lists the MI325 series among its current Instinct data center GPU products12.
#7
Maia 200 (Microsoft)
216 GB HBM3e
Microsoft’s in-house inference accelerator pairs 216 GB of HBM3e at 7 TB/s with 272 MB of on-chip SRAM, built on TSMC’s 3nm process15. It isn’t sold to other companies; Microsoft says Maia 200 is deployed in its US Central datacenter region near Des Moines, Iowa, with the US West 3 region near Phoenix, Arizona, coming next15. It has the most HBM of any hyperscaler’s own chip in the ranked table.
#8
TPU7x, Ironwood (Google)
192 GB
Google’s seventh-generation TPU carries 192 GB of HBM per chip at approximately 7.37 TB/s, according to the TPU7x documentation16. Each chip is built from two chiplets, each with its own 96 GB of HBM, and a 3D torus interconnect lets slices scale to 9,216 chips16. Google Cloud made TPU7x generally available on March 31, 2026, after a preview from November 24, 202517. Google doesn’t name the HBM generation on the page.
#8
Instinct MI300X (AMD)
192 GB HBM3
The oldest AMD part in the table, launched December 6, 2023, has 192 GB of HBM3 and 5.3 TB/s14. AMD’s footnote derives the precise 5.325 TB/s from an 8,192-bit memory bus at a 5.2 Gbps data rate14. It is the only ranked part on HBM3 rather than HBM3E or HBM4, and AMD’s 2025 annual report still lists the MI300 series among its Instinct products12.
#10
Blackwell GPU in GB200 NVL72 (NVIDIA)
186 GB HBM3E
NVIDIA’s Blackwell datasheet lists each Blackwell GPU in the GB200 NVL72 rack at 186 GB of HBM3E and 8 TB/s, against 180 GB and 7.7 TB/s in the HGX B200 server6. The GB200 NVL72 page counts memory per GB200 superchip instead, 372 GB of HBM3E for its two GPUs7. NVIDIA said in February 2025 that CoreWeave had become the first cloud provider to make GB200 NVL72-based instances generally available8.
Announced, not yet shipping
These parts have maker-stated HBM figures but no maker confirmation that they are shipping or generally available as of October 13, 2026, so they are listed apart and unranked. AMD launched the MI455X on July 23, 2026 with 432 GB of HBM4 in 12 stacks and 23.3 TB/s20, and says its Helios racks, built on 72 MI455X GPUs each, are “now in production”; OpenAI expects to bring Helios online beginning in the fourth quarter of 202621. AMD’s MI430X page lists the same 432 GB of HBM4 and 23.3 TB/s, with availability expected in 202722; AMD’s MI400 Series overview gives the MI430X’s bandwidth as 2.3 TB/s23, which the table treats as a typo for the figure on the product’s own page. Google’s TPU 8i and TPU 8t list 288 GB and 216 GB of HBM at 8,601 and 6,528 GB/s24. Huawei says its Ascend 950DT will pair the chip with 144 GB of its own HiZQ 2.0 HBM at 4 TB/s, available in the fourth quarter of 202625.
As of All figures vendor-statedUnranked
Announced accelerators not yet confirmed as shipping, vendor-stated HBM per chip, as of 2026-10-13
Google states TPU 8 bandwidth in GB/s (8,601 and 6,528); the column shows the same figures in TB/s. Huawei’s figures come from a September 2025 keynote, not a datasheet, and are plans.